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NUF4107FC
Four Channel EMI Pi?Filter
Array with Full USB Filter
This device is a four ? channel EMI filter array for data lines. Greater
than ? 35 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers USB filtering circuitry with speed detection.
This includes the inline resistors for impedance matching and EMI
filtering. ESD protection is provided across all capacitors.
http://onsemi.com
CIRCUIT DESCRIPTION
Features
? EMI Filtering and ESD Protection for Data Lines
? USB 1.1 Filtering Provided with Speed Detection
? Integration of 27 Discretes Offers Cost and Space Savings
? 350 m m Solder Spheres
? All TVS Protected Inputs Comply with IEC61000 ? 4 ? 2 (Level 4)
30 kV (Contact)
30 kV (Air)
? Low Profile Flip ? Chip Packaging
? MSL 1
? All Pins Exceed 2000 V Human Body Model (Note 1)
? Pb ? Free Package is Available*
Typical Applications
? EMI and USB Filtering and ESD Protection for Data Lines
? Cell Phones
? Handheld Portables
? Notebook Computers
? MP3 Players
MAXIMUM RATINGS (T A = 25 ° C)
Rating Symbol Value Unit
A1
A2
A3
A4
A5
A6
D 1
D 2
D 11
D 3
D 5
D 7
D 9
C 1
C 2
B 2
C 3
B 3
C 5
B 4
C 7
B 5
C 9
R 1
R 2
R 3
C 4
R 4
C 6
R 5
C 8
R 6
C 10
B 1
C1
R 7
C2
C3
D 4
C4
D 6
C5
D 8
C6
D 10
ESD Discharge IEC61000 ? 4 ? 2 (Note 1) V PP kV
? Air Discharge, Contact Discharge 30
Human Body Model 16
Machine Model 0.4
DC Power per Resistor P R 100 mW
DC Power per Package P T 600 mW
Junction Temperature T J 150 ° C
Operating Temperature Range T op ? 40 to +85 ° C
Storage Temperature Range T stg ? 55 to +150 ° C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. This does not include Pins B1, C1 and C2
FLIP ? CHIP ? 17
CASE 499AD
A1
MARKING DIAGRAM
4107 = Device Code
A = Assembly Location
4107AYWW G Y = Year
G WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping ?
NUF4107FCT1    Flip ? Chip  3000 Tape & Reel
NUF4107FCT1G
Flip ? Chip
(Pb ? Free)
3000 Tape & Reel
*For additional information on our Pb ? Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2006
March, 2006 ? Rev. 3
1
Publication Order Number:
NUF4107FC/D
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相关代理商/技术参数
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